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Product Details:
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| Power Supply: | ≤15V DC Or ≤3.0mA DC | Input Impedance: | 4kΩ To 6kΩ |
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| Insulation Resistance: | 100MΩ,100VDC | Permissible Overload: | 2 Times Full Scale |
| Blasting Pressure: | ≥3 Times Full Scale | Measured Medium: | Air |
| Highlight: | SOP Package Pressure Sensor,Pneumatic Hydraulic Pressure Sensor,Vacuum Packaging Machine Pressure Sensor |
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Product Description:
XGZP101SB1 Pressure Sensor SOP Package MEMS Pneumatic Hydraulic 100KPa Vacuum Packaging Machine
Features:
Product Features
Measurement range: -100 kpa to 0kPa... 700kPa
MEMS technology
Gauge pressure form
SOP or DIP packaging form
It is applicable to non-corrosive gases
Operating temperature range: -30℃ to +100℃
The back pressure chamber of the chip is under pressure
The direction of the pins can be selected
"Application field"
Medical fields such as electronic blood pressure monitors, ventilators, oxygen generators and monitors
Automotive electronics fields such as tire pressure gauges, MAP, power steering, and brake assistance
The field of sports and fitness equipment such as massagers, massage chairs and air mattresses
Vacuum packaging machines, vacuum mixers, vacuum blenders, vacuum preservation boxes, vacuum pumps and other vacuum negative pressure fields
Washing machines, beer machines, coffee machines, vacuum cleaners, water purifiers, pressure gauges, pneumatic components and other fields
Product Overview
The XGZP type piezoresistive pressure sensitive element is a pressure sensor suitable for fields such as biomedicine and automotive electronics, and its core part
It is a silicon piezoresistive pressure-sensitive chip processed by MEMS technology. The pressure-sensitive chip consists of an elastic membrane and four integrated on the membrane
Composed of four resistors, the four varistors form a Wheatstone bridge structure. When pressure is applied to the elastic membrane, the bridge will generate a connection with the applied resistor
A voltage output signal in which the pressure is in a linear proportional relationship.
The XGZP type pressure-sensitive components are OEM components packaged in standard SOP6 and DIP6 forms, facilitating surface mount for users
Or it can be installed by direct insertion in two rows
It features excellent linearity, repeatability and stability, high sensitivity, and is convenient for users to debug and compensate for output and temperature drift.
Specifications:
| Measurement range | -100 kpa to 0kPa... 700kPa |
| Packaging form | SMD/DIP |
| Operating temperature | 0℃ to 40℃ |
| Operating temperature range | -30℃ to +100℃ |
Contact Person: Miss. Xu
Tel: 86+13352990255
